Principal High Speed Board Designer (TERADYNE, Agoura Hills, CA)

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.

Our Purpose
TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day.

We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team – one that makes better decisions, drives innovation and delivers better business results.

Opportunity Overview

Teradyne Silicon Technology Engineering team is seeking an experienced Principal High-Speed Board Designer to lead the design and development of advanced prototype and system characterization hardware for next-generation ASIC platforms.

This role is a key enabler of our strategy to own the end-to-end signal path, from ASIC and package through interconnect and instrument. The successful candidate will develop characterization and validation platforms that accelerate silicon bring-up, validate signal integrity, and reduce system integration risk before production hardware is available.

This is not a traditional PCB design role. The position requires close collaboration with ASIC designers, package engineers, signal integrity engineers, system architects, and instrument development teams to co-design the complete signal delivery path.

Key Responsibilities

• Lead architecture, design, layout, and bring-up of high-speed characterization and prototype boards for custom ASIC programs.
• Develop independent system characterization platforms to validate ASIC performance ahead of instrument readiness.
• Co-design the complete signal path, including:
• ASIC package
• PCB interconnect
• Connectors and cables
• Instrument interfaces
• Test fixtures and sockets
• Partner with ASIC, package, SI, and system teams to optimize signal integrity, power integrity, timing, and overall system performance.
• Perform channel analysis, loss budgeting, and design tradeoff studies for high-speed serial links.
• Define measurement methodologies for silicon characterization, debug, and performance correlation.
• Drive board bring-up, debugging, and root-cause analysis of electrical and system-level issues.
• Support prototype development through manufacturing, assembly, and lab validation.
• Establish reusable board design methodologies and best practices for future ASIC programs.
  
  

All About You
We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you’re ready to join us in this mission, take a closer look at the minimum criteria for the position.

• BS/MS in Electrical Engineering or related field.
• 8+ years of experience designing high-performance digital and mixed-signal circuit boards.
• Expertise in high-speed PCB design for data rates of 25 Gbps and above.
• Strong understanding of:
• Experience with industry-standard EDA tools such as:
• Experience with high-speed interfaces and protocols such as:
• Hands-on lab experience with oscilloscopes, VNAs, TDR/TDT, BERTs, and high-speed measurement equipment.
• Strong debugging and problem-solving skills.
• Experience supporting ASIC silicon bring-up and characterization.
• Knowledge of advanced packaging technologies, chiplets, and heterogeneous integration.
• Familiarity with electromagnetic simulation tools, including Ansys HFSS and Keysight ADS.
• Experience working closely with semiconductor development teams from concept through production.
• Understanding of manufacturing, DFM, DFT, and volume production requirements.

Compensation
The base salary range for this role is $197,800-$316,400. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.

Incentive Plan: This job is eligible for discretionary bonus(es) based on financial performance.

Benefits: Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more. Please click here to see details.

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