Thermal Mechanical Engineer (Teradyne, Agoura Hills, CA)

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.

Our Purpose

TERADYNE, where experience meets innovation and drives excellence in every connection. We are fueled by creativity and diverse perspectives across our workforce. Our employees are supported to innovate and learn something new every day.

We cultivate a culture of inclusion that respects individual strengths, viewpoints, and experiences because better teams deliver better outcomes.

Opportunity Overview

Teradyne is expanding its centralized mechanical engineering capability in Agoura Hills to support next-generation semiconductor test equipment. This team partners across product development to solve complex mechanical and thermal challenges in high-performance capital equipment, from concept development through integration, verification, and release.

As a Thermal Mechanical Engineer, you will own thermal design recommendations, model-to-test correlation, liquid cooling trade-offs, design verification, and closure of thermal risks for complex semiconductor capital equipment. This is a career-level role for an engineer who wants meaningful technical ownership across design, analysis, prototype, integration, and validation work.

• Own thermal analysis and validation plans for assigned components or subsystems
• Develop board-level and system-level cooling solutions for next-generation semiconductor test equipment
• Evaluate liquid cooling architectures, cold plates, heatsinks, fluid connectors, and related thermal-mechanical hardware
• Perform thermal analysis, liquid cooling analysis, and CFD modeling to support design decisions
• Correlate simulation results with experimental test data and translate findings into clear design recommendations
• Lead design reviews for assigned scope and drive closure of thermal risks, action items, and verification gaps
• Collaborate with suppliers and cross-functional teams on manufacturable thermal-mechanical solutions

All About You

We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you are ready to join us in this mission, take a closer look at the minimum criteria for the position.

• Bachelor's degree in Mechanical Engineering or related discipline with typically 5+ years of relevant experience, or Master's degree with typically 3+ years of relevant experience
• Strong experience with board-level thermal analysis, liquid cooling, cold plates, and thermal-mechanical design
• Experience using thermal or CFD tools such as Flotherm, SolidWorks Flow Simulation, or similar tools
• Experience with liquid delivery systems such as pumps, filters, piping, fittings, and cooling loops
• Proficiency with SOLIDWORKS and PDM or similar engineering data management systems
• Ability to independently solve engineering problems, make sound design trade-offs, and communicate recommendations clearly
• Strong written and verbal communication skills, including design reviews, technical reports, and cross-functional presentations
• Proactive, hands-on mindset with the ability to take ownership of assigned work and collaborate effectively across engineering teams

Preferred

• Experience with semiconductor test equipment, high-density electronics, or capital equipment
• Experience with cooling distribution hardware, liquid-cooled platform architecture, custom fluid connectors, or thermal design verification
• Experience with printed circuit board tools such as CircuitWorks or Allegro
• Experience correlating thermal models to experimental test data
• Familiarity with SEMI standards

What Success Looks Like

Success in this role means driving assigned thermal scope to closure, making clear design recommendations, managing technical risks, and improving the quality and speed of platform-level engineering execution. The successful candidate will connect analysis, testing, supplier input, and design reviews into practical engineering decisions.

Growth Opportunity

This role offers the opportunity to take ownership of meaningful thermal design work within an expanding centralized engineering group supporting advanced semiconductor test platforms. The successful candidate will help improve platform capability, support design verification, influence thermal design approaches, and grow as a technical leader in a high-impact industry.

We are only considering candidates local to position location and are unable to provide relocation for this position.

This position is not eligible for visa sponsorship.

Compensation

The base salary range for this role is $100,000 - $160,000. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.

Incentive Plan: This job is eligible for discretionary bonus(es) based on financial performance.

Benefits

Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more.  Please click here to see details.

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