Sr. Embedded Firmware Engineer

Organization & Role

Embedded BSP engineering is part of the hardware engineering organization.  This team develops the embedded board support package for all Teradyne Semiconductor Test Division instruments and is involved in key architecture choices to select the processors, OS, tools, and network options.

Responsibilities

This position is for a senior level embedded software engineer that develops embedded solutions for Digital, DC, and RF instrumentation. He/she will participate various multi-site development teams composed of many disciplines of engineering and manufacturing.  This engineer will design, develop, test, and debug software that supports the overall team’s implementation of the product.

Basic Qualifications & Skills

Experience developing in the Linux environment.

Strong architecture, algorithm, and coding skills (C, C++, shells, scripting, multi-threading)

Nice To Have
Embedded processing (bare metal, small OS, interrupt handling, efficiency in memory/code)
Linux (build, config, device tree, drivers, memory mapping - ATU)
Toolchain (acquiring, deploying), makefiles
Debugging (gdb, IDE, codeWarrior)
Source control (ClearCase/VersionVault, git)
Networking (DHCP, TCP, switch config)
PCIe (switch config, multicast, non-transparent)
Communication (USB, serial)

Additionally, must be:

Self-motivated, eager to learn
Good communicator, self-reliant but willing to request / get help
Time management skills (juggling multiple projects, maintaining priorities)

Education

BS/MS EE/CE/CS degree or equivalent with a minimum of 10 years in embedded software development

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