Senior Signal Delivery Engineer (Compute Test Division; North Reading, MA)

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.

Our Purpose  
TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day. 
 
We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team – one that makes better decisions, drives innovation and delivers better business results. 
 

Opportunity Overview 
The Innovation Lab is an advanced R&D team that is part of the Semiconductor Test Division at Teradyne.   We have a dual charter to technically support the growth of the division and company: 

• Create long-term differentiated solutions for our core Semiconductor Test business by exploring new technologies and architectures to be applied against current and emerging key requirements for our customers. 
• Working with our Business Development Office, develop differentiated solutions to new business opportunities that are relatively adjacent to our core business.  These will generally enable new businesses within our existing customer base. 

We are seeking a Senior Signal Delivery Engineer to join the Teradyne Innovation Lab – the team responsible for developing breakthrough concepts for use in Semiconductor Test Systems of the future. This role is critical in ensuring high-performance signal integrity across advanced semiconductor interfaces, including UCIe-based architectures and microbump interconnects. You will be instrumental in shaping the future of chiplet-based systems, fine pitch probing, and high-speed interconnects. 

• Lead the design and analysis of high-speed signal delivery systems supporting high speed industry data interfaces such as PCIe, UCIe, etc. 

• Develop simulation models and perform signal integrity analysis to ensure robust performance across various operating conditions 

• Collaborate with cross-functional teams including packaging, PCB layout, and silicon design to optimize signal paths and microbump connections 

• Build and validate prototypes to test signal delivery performance and compliance of system probe card interfaces including microbump and fine pitch probing specifications 

• Support product development from concept through production, ensuring signal integrity and reliability 

• Ensure compliance with industry standards and internal quality metrics  

• Drive PCB design efforts involving very large panels, high layer count sequential builds, and fine pitch sequential lamination 

• Lead development of ultra-fine pitch MLO (Multi-Layer Organic) substrates with embedded active and passive components 

• Coordinate and manage cross-site, global engineering teams to ensure alignment and execution across time zones 

• Provide clear, data-driven risk assessments and mitigation strategies to management and stakeholders 

 
All About You 
We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you’re ready to join us in this mission, take a closer look at the minimum criteria for the position. 

• Bachelor’s or Master’s degree in Electrical Engineering or related field 

• Minimum 7 years of experience in signal integrity or high-speed hardware design 

• Proven experience with signal delivery in advanced semiconductor systems 

• Strong working knowledge interconnect standards 

• Experience working with microbump technology and its impact on signal integrity 

• Familiarity with fine pitch probing techniques and associated challenges 

• Proficiency in simulation tools such as Ansys HFSS, SIwave, ADS, or equivalent 

• Experience with PCB layout tools and design for signal integrity 

• Familiarity with lab equipment for signal validation (oscilloscopes, TDR, VNA) 

• Strong analytical and problem-solving skills 

• Excellent communication and mentorship abilities 

• Demonstrated ability to lead and collaborate with global engineering teams 

• Skilled in presenting technical risk assessments and trade-offs to leadership 

• Preference for candidates with experience in chiplet-based and UCIe system design 

• Preference for candidates with experience in MEMS needle array technology 

• Preference for candidates with experience in cross-functional hardware development 

We are only considering candidates local to position location and are unable to provide relocation for this position.  

This position is not eligible for visa sponsorship.  

Compensation: 
The base salary range for this role is $166,300- 266,100. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.  

Incentive Plan: This job is eligible for discretionary bonus(es) based on financial performance.

Benefits: 

Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more.  Please click here to see details. 

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