We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!

We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive.

Our Purpose

TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day.

We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team – one that makes better decisions, drives innovation and delivers better business results.

The Opportunity

The Semiconductor Test Division has an immediate need for a Signal and Power Integrity Hardware Engineer to develop measurement instrument products.  The position reports to the Signal and Power Integrity Manager.

This hardware engineering position participates as a key person in the hardware design workflow necessary to physically realize complex rf, analog, digital and mixed-signal circuits at both the board and package substrate level.  It serves as a primary interface function between PCB design, hardware engineering and manufacturing teams.  This person will play an important role in all phases of hardware development from providing assessments on architectural feasibility, planning for signal and power integrity signoff validation, performing detailed interconnect optimization and constraint development, working with the PCB design team to insure that performance and manufacturability targets are met, and collaborating with hardware engineering to insure that our simulation models and methodologies can be validated against functional prototypes. 

Key Responsibilities:

• Perform signal and power integrity analysis for complex PCB and package designs.
• Model and simulate high‑speed digital, analog, and RF circuits to ensure compliance with performance targets.
• Conduct timing, impedance, and electromagnetic field analysis using industry‑standard tools.
• Collaborate with hardware, PCB layout, and manufacturing teams to guide design decisions.
• Validate simulation results using lab equipment such as VNAs, TDRs, and high‑speed oscilloscopes.
• Perform S‑parameter, Z/Y‑parameter, and PDN analysis including target impedance and IR drop evaluation.
• Support design reviews with presentations, reports, and technical recommendations.
• Work with PCB fabricators and suppliers to ensure manufacturability and adherence to specifications.
• Recommend and develop innovative PCB design and process improvements.

All About You
We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If you’re ready to join us in this mission, take a closer look at the minimum criteria for the position.

• Bachelor’s Degree in Engineering (Manufacturing, Mechanical or Electronics preferred).
• 2+ years in hardware engineering role developing equivalent technologies
• Strong understanding of EM theory, transmission line theory, impedance control, and EMI/EMC mitigation.

• Experience with modeling and simulating PCBs and packages for SI/PI and timing analysis.
• Familiarity with IBIS models and application of the IBIS 7.0 standard.
• Proficiency with tools such as Cadence Sigrity, Ansys HFSS/SI‑Wave/Maxwell/3D Layout, HyperLynx, or ADS.
• Knowledge of SPICE‑based tools including Cadence Spectre, PSpice, and HSpice.
• Experience with PCB design workflows, fabrication processes, and materials technologies.
• Proficiency with Cadence Allegro, Concept schematic entry, and SI/PI simulation environments.
• Experience using 2D/3D electromagnetic solvers (e.g., Sigrity, Clarity).
• Strong analytical and problem‑solving skills with hands‑on lab experience.
• High‑voltage PCB design experience (1kV or higher) is a plus.
• Programming skills in Tcl, Python, Perl, MATLAB, C/C++, C#, or Visual Basic are a plus.

We are only considering candidates local to position location and are unable to provide relocation for this position.

Compensation:
The base salary range for this role is $86,700-$138,700. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.

Incentive Plan: This job is eligible for discretionary bonus(es) based on financial performance.

Benefits:

Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more.  Please click here to see details.