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Field Application Engineer

ID:  1484
Function:  Engineering
Location: 

Shanghai, CN


We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!.

Organization & Role

  • This field application engineer position delivers technical expertise for solution implementation to customer based on Teradyne Ultraflex/J750 product and service. It provides support for assessment of customer needs, implementation of the solutions on Ultraflex/J750 as well as production release support. 
  • We are looking for a highly motivated, energetic, driven Field Application Engineer who will work collaboratively with the team as well as independently to determine and develop imaginative, thorough, and practical application solutions. Our engineers thrive on a dynamic, customer-driven, global work environment.

Responsibilities

1)  Test Program Development and Release (SOC chip: Digital, HSIO, MS, RF)

  • Test plan generation as to device spec and test requirement.
  • Test program development on UF: offline coding and online debugging.
  • Load board schematics design and layout review.
  • Device correlation and test program release at production site.
  • Travel to customer/production site

2)  Customer Support

  • Build up good communication channel with customer
  • Understand customer’s technical problem and provide prompt consulting
  • Technical issue tracking and escalation
  • Customer training, knowledge sharing, workshop presentation

 

Basic Qualifications & Skills

  • Bachelor or Master degree in IC design, electrical engineering, RF, electronic, communication, microwave; 1-3 years working experience.
  • Knowledge of VB, Windows, C, C++
  • Experience of IC Design or ATE is Preferred
  • Can work under pressure.
  • Eager to new challenge, hunger for new technology
  • Strong English and Mandarin Communication Skills
  • Strong Interpersonal Skills and Problem-Solving Skills
  • Good at Team Work

 


Job Segment: Application Engineering, Manufacturing Engineer, Engineer, Field Engineer, Consulting, Engineering, Technology