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Field Application Engineer

ID:  1566
Function:  Engineering

Shanghai, CN

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world!.

Organization & Role

  • This field application engineer position delivers technical expertise for solution implementation to customer based on Teradyne Ultraflex/J750 product and service. It provides support for assessment of customer needs, implementation of the solutions on Ultraflex/J750 as well as production release support. 
  • We are looking for a highly motivated, energetic, driven Field Application Engineer who will work collaboratively with the team as well as independently to determine and develop imaginative, thorough, and practical application solutions. Our engineers thrive on a dynamic, customer-driven, global work environment.


1)  Test Program Development and Release (SOC chip: Digital, HSIO, MS, RF)

  • Test plan generation as to device spec and test requirement.
  • Test program development on UF: offline coding and online debugging.
  • Load board schematics design and layout review.
  • Device correlation and test program release at production site.
  • Travel to customer/production site

2)  Customer Support

  • Build up good communication channel with customer
  • Understand customer’s technical problem and provide prompt consulting
  • Technical issue tracking and escalation
  • Customer training, knowledge sharing, workshop presentation


Basic Qualifications & Skills

  • Test/Product engineering experience in analog, digital, mixed signal and RF testing and test development preferred
  • Prior programming experience on Teradyne or other semiconductor ATE platforms preferred.
  • Knowledge of Visual Basic, Windows NT, C, C++ programming and UNIX and/or Windows.
  • Knowledge on handler and prober interface experience will be a plus
  • Possess team skills and has ability to work independently as well
  • Strong analytical skills and practical problem solving skills
  • Solid presentation skills
  • Strong proven interpersonal skills and commitment to teamwork and “can-do” spirit
  • Outstanding written and verbal communication skills in both English and native language
  • Proven technical record   
  • Demonstrate strong interpersonal and relationships-building skills
  • Supervisory experience in leading teams (locally and globally) with past experience in employee management may qualify for senior position
  • Willing to Travel (example >25%)


  • Bachelor or Master degree in IC design, electrical engineering, RF, electronic, communication, microwave; 3-5 years working experience.
  • Knowledge of VB, Windows, C, C++
  • Experience of IC Design or ATE is Preferred
  • Can work under pressure.
  • Eager to new challenge, hunger for new technology
  • Strong English and Mandarin Communication Skills
  • Strong Interpersonal Skills and Problem-Solving Skills
  • Good at Team Work

Job Segment: Application Engineering, Manufacturing Engineer, Field Engineer, Electrical, Engineer, Engineering